Canteliver Probe Card
MPI Cantilever Probe Card is broadly used on gold bump and pad wafer testing for Exhibit driver, logic, and memory gadget. MPI’s cantilever probes are the corresponding response for the requires of fine pitch, compact pad size, large pace, less cleansing, multi-DUT, high pin count, and ultra-reduced leakage needs. With remarkable craftsmanship, innovative architecture and confirmed methodologies depending on mechanical and electrical simulation/measurement benefits, generating MPI the highest cantilever company around the globe.
FCB Probe Card
The FCB Probe Card is easily the most experienced technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is really a confirmed solution for a variety of semiconductor output assessments from early engineering pilot-runs to higher quantity production (HVM). FCB is ready for device demanding substantial signal integrity probing (SI) and/or power integrity probing (PI). Purposes include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the globe’s greatest overall Charge-of-ownership (COO) for many DUT apps.
EVS Probe Card
The EVS Probe Card is definitely an improvement above the standard buckling beam probe card. Essential attributes are bigger recent carrying capacity (C.C.C.) and decreased balanced Get hold of force (BCF), together with General MEMS-like properties. EVS can easily fulfill the requirement of State-of-the-art wafer probing. Precise alignment and exceptional planarity control are classified as the key variables contributing to secure Make contact with resistance. With its ability and overall performance, EVS Probe Card is an excellent option for Sophisticated probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to demand from customers for ever finer pitch. It really is created for smaller Al pad, and is perfect for little pitch software with peripheral and whole array sample. With specific alignment and much better planarity Regulate, Osprey can attain larger efficiency by multi-DUT design. The forming wire (FW) kind needle developed with MPI’s have micro fabrication method not only delivers higher-excellent more info general performance but in addition permits quick needle substitution and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle which is designed for the demand from customers of small drive probing. In addition, it comes along with the opportunity to fulfill significant C.C.C. and higher pin counts software. The MEMS approach ensures highly consistent needle characteristics, plus the Exclusive composition style and design allows precise alignment and planarity control.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/